发明名称 |
Mechanical shock and impact resistant ceramic semiconductor package and method of making the same |
摘要 |
A mechanical shock and impact resistant ceramic semiconductor package is formed by applying a resilient, non-conductive, non-absorbent, heat-resistant material onto the surfaces of said package. In a dual in-line ceramic package a silicone polymer is discretely applied onto at least one end of the longitudinally opposite end edge surfaces. This renders the package mechanical shock and impact resistant. |
申请公布号 |
US4355719(A) |
申请公布日期 |
1982.10.26 |
申请号 |
US19800179146 |
申请日期 |
1980.08.18 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
HINDS, SALLY K.;WEILER, PETER M.;HEWITT, ROBERT R. |
分类号 |
B65D81/00;H01L23/00;H05K13/00;(IPC1-7):B65D85/30;H05F3/02;H05K5/00;H05K3/00 |
主分类号 |
B65D81/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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