| 摘要 |
The semiconductor light emitting package is provided to simplify the production process through the improvement of the lead frame structure by omitting the flexion process forming fabricating process on the outside lead frame. The outside lead frame(120) and the inner lead frame(122) are formed as the hexahedron form. The supporter(124) is formed as the sheet configuration. The outside lead frame is protruded to the outside of the housing(110). The outside lead frame is thickly cut. The inner lead frame is thickly formed. The supporter is thinly formed. The outside lead frame does not have the horizontal bent structure along the housing surface. The outside lead frame has the protruded structure.
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