| 摘要 |
<p>METHOD FOR SOLDERING CONVENTIONALLY UNSOLDERABLE SURFACES A method for joining conventionally unsolderable surfaces, comprising the steps of coating the surfaces with an adhesive, coating the adhesive with solderable metallic particles while the adhesive is tacky, and, after the adhesive is cured, soldering said surfaces together, the solder adhering to the metallic particles and forming a bond between the surfaces. The adhesive is preferably a high-temperature resistant adhesive. The solderable metallic particles are preferably a combination of granules and powder, preferably of copper. The conventionally unsolderable surfaces include, but are not limited to, glass, porcelain, conventionally unsolderable metals such as steel, wood and paper products.</p> |
