| 摘要 |
PURPOSE:To protect the surface of a hybrid IC simply while facilitating marking by fastening a film case by using a lead for fixing an IC substate. CONSTITUTION: Leads 3 for fixing a hybrid IC substrate 1 are penetrated into slits 7 in a film case 4 and bent, thus fastening the case 4 to the substrate 1. Accordingly, the surface of a hybrid IC is protected simply while marking can be conducted easily by employing the case 4, the surface of which has no irregularities, thus improving appearance properties and reliability.
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