<p>An insulating layer ( 5 ) and a conductive seed layer ( 6 ) are applied to a substrate ( 1 ) in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an insulator and the palladium chloride is a catalyst. The layer is heated with UV to cure it. The layer is plasma etched to expose more of the palladium chloride, which acts as a catalyst for electrodes plating of the conductive seed layer. A thicker conductive layer ( 7 ) is then electroplated onto the seed layer. These steps may be repeated for successive insulating and/or conductive layers.</p>
申请公布号
DE60325895(D1)
申请公布日期
2009.03.05
申请号
DE2003625895
申请日期
2003.12.23
申请人
UNIVERSITY COLLEGE CORK-NATIONAL UNIVERSITY OF IRELAND, CORK
发明人
BRUNET, MAGALI;CONNELL, ANDREW MARK;MCCLOSKEY, PAUL;O'DONNELL, TERENCE;O'REILLY, STEPHEN;O'MATHUNA, SEAN CIAN