| 摘要 |
Base metal layer(11), which is familiar with semiconduct or and soakable to solder is formed on the semiconductor wafer(10). Then the solder layer(12) is formed on the base metal(11) by evaporation. According to this method, adhesion between silicon wafer(10) and this first metal layer are formed in vaccum. The oxide cannot be formed between each layer and the property of adhesion is good. Solder layer has a uniform thickness because it is formed by evaporation. Metal layer for preventing oxidation is made on the solder(12).
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