发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make the breaking position accurate and to prevent poor appearance and degradation in moisture resistance by narrowing the width of tab leads at connecting parts to an outer frame. CONSTITUTION:The edge part of the tab lead 2 becomes steeply thin toward the outer frame 5 and connected to the inside of the frame. A pellet 3 is mounted on a tab 4, wires are connected, and sealing 11 is performed. Thereafter, the frame is vertically bent with respect to the surface of the plate several times, and the frame can be simply separated at the narrow part. Then linking parts 8 and a frame 6 are cut away and the device is completed. In this constitution, since the breaking position of the tab lead is accurate, and the breaking is ensured, the poor appearance such as damages on the sealing resin, and the remaining end parts of the tab lead that are not cut away as well as the degradation in moisture resistance can be eliminated.
申请公布号 JPS57172757(A) 申请公布日期 1982.10.23
申请号 JP19820049132 申请日期 1982.03.29
申请人 HITACHI SEISAKUSHO KK 发明人 NAKAYAMA HIROYOSHI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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