发明名称 MANUFACTURE OF ELECTRIC WIRING CIRCUIT FOR HIGH TEMPERATURE
摘要 PURPOSE:To easily obtain the electric wiring circuit for high temperature by a method wherein a temporary wiring circuit is formed by providing a coating of inorganic clay on a core material, the core material is exposed from the coating, an insulating wiring circuit is formed, and an electric conductor is formed by pouring fused metal into the cavity in the insulating wiring circuit. CONSTITUTION:By using a flexible core material 1, the coating 2 is not broken even when a temporary wiring circuit 4 is formed by winding the coating 2 around it. As the inorganic clay is used as an insulating material, insulation efficiency can be displayed at the approximate temperature of 1,000 deg.C or above, and also, different from a powdery or aqueous inorganic material, a partition material is unnecessary for this insulating material, thereby enabling to simplify the manufacture of the above wiring circuit. By using a tin wire, which is fused at a temperature far lower than approximate temperature of 1,000 deg.C at which the coating 2 is sintered, as the core material 1, the breakage of the coating 2 due to the difference of thermal expansion between the core material 1 and the coating 2 can be prevented, and the core material can also be obtained easily. Also, an excellent electric conductor 8 can be formed by pressure- fitting a fused indium metal into the cavity 6 in a pure nitrogen gas atmosphere.
申请公布号 JPS57172709(A) 申请公布日期 1982.10.23
申请号 JP19810057075 申请日期 1981.04.17
申请人 TOKYO SHIBAURA DENKI KK 发明人 MORIYAMA HIDESHIGE
分类号 H01F27/32;H01F41/04;H01F41/12;H02K3/02 主分类号 H01F27/32
代理机构 代理人
主权项
地址