发明名称 TREATING METHOD AND DEVICE FOR SEMICONDUCTOR WAFER
摘要 PURPOSE:To effectively clean a semiconductor wafer with a strong cleaning force by atomizing pure water of shower state to the wafer when the wafer is cleaned and then cleaning it by an overflow. CONSTITUTION:A treating tank 11 in which a drain valve 13 opening and closing by a pneumatic cylinder 16 is projected is arranged at the lower part in a reservoir tank 17 which totally receives drain water from a plurality of treating tanks 11. The tank 11 is formed of a hollow water tank 12 along the lengthwise direction of a semiconductor wafer treating device, a pure water supply pipe 15 is connected thereto, and a pure water shower having fine pores having a diameter of approx. 0.5mm. is mounted on the top end. The device is thus constructed, many semiconductor wafers are filled in the tank 11, the water remaining so far is first drained, pure water supply quantity is increased, and is atomized in a shower state to the wafers. Thereafter, the wafers are cleaned by an overflow, and this cycle is repeated.
申请公布号 JPS57170537(A) 申请公布日期 1982.10.20
申请号 JP19810055782 申请日期 1981.04.14
申请人 TOKYO SHIBAURA DENKI KK 发明人 FUJIE HIDEO
分类号 H01L21/304;(IPC1-7):01L21/304 主分类号 H01L21/304
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