发明名称 Wireless chip and electronic device having wireless chip
摘要 It is an object to provide a wireless chip which can increase a mechanical strength, and a wireless chip with a high durability. A wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, and a conductive layer connecting the chip and the antenna. Further, a wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, a sensor device, a conductive layer connecting the chip and the antenna, and a conductive layer connecting the chip and the sensor device. Moreover, a wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, a battery, a conductive layer connecting the chip and the antenna, and a conductive layer connecting the chip and the battery.
申请公布号 US9350079(B2) 申请公布日期 2016.05.24
申请号 US201414269772 申请日期 2014.05.05
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Suzuki Yukie;Arai Yasuyuki;Yamazaki Shunpei
分类号 H01L29/00;H01Q9/04;G06K19/077;H01Q1/22;H01Q23/00 主分类号 H01L29/00
代理机构 Robinson Intellectual Property Law Office, P.C. 代理人 Robinson Eric J.;Robinson Intellectual Property Law Office, P.C.
主权项 1. A semiconductor device comprising: an antenna comprising a first conductive layer, a second conductive layer, and a third conductive layer; and a battery overlapping the first conductive layer and the second conductive layer, wherein the third conductive layer is bent, wherein the first conductive layer is in direct contact with a first surface, wherein an entirety of the first conductive layer is provided over the first surface, wherein the first surface is coplanar with a first region of the third conductive layer, wherein the second conductive layer is in direct contact with a second surface, and wherein the second surface is coplanar with a second region of the third conductive layer.
地址 Atsugi-shi, Kanagawa-ken JP