发明名称 BOILING COOLING TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To increase the thickness of a metallic tube by providing an element containing container in the metallic tube of circular or elliptical section and drawing externally the electrodes of the element from the side surface of the container, thereby reducing the quantity of coolant. CONSTITUTION:A part of a metallic tube 10 of a circular shape slightly larger than the section of an element stack 1 is cut at a notch 10a in an axial direction, the stack is inserted from a window 10a1, the end surface is sealed with a mirror plate 10b, and the part 10c of the tube 10c is hermetically sealed. The stack 1 is held on a brearer 10a2 in a doby 10a, the main electrode of an element 1a and a bushing 13 passing through a cover 10c are connected with a strip 14, and is dipped in coolant 15. In this structure, even if the number of the element 1a is increased, the body 10a and the cover 10c are lengthened, the bushing 13 can be mounted without difficulty, the diameter of the body is not necessarily increased, and the coolant can be saved. In addition, the section of the body 10a is adapted for a pressure vessel, and the thickness of the plate can be reduced.
申请公布号 JPS57170558(A) 申请公布日期 1982.10.20
申请号 JP19810056808 申请日期 1981.04.14
申请人 MITSUBISHI DENKI KK 发明人 MIKANE TOSHIO
分类号 H01L23/44;H01L23/427;H01L25/11 主分类号 H01L23/44
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