PRODUCING PRINTED CIRCUITS BY SOLDERING METAL POWDER IMAGES

摘要

By the process of this invention, printed circuits are prepared containing an electrically conductive wiring trace from materials having adherent and non-adherent surface areas, e.g., printed circuit substrates bearing an imaged photoadhesive layer. Onto the adherent surface areas of the material is applied solder wettable metal particles, and any excess particles are removed from the non-adherent areas. The metallized areas are soldered to form an electrically conductive wiring trace.