发明名称 |
Method of selectively depositing a metal on a surface by means of sputtering |
摘要 |
It has been discovered that by cleaning a substrate having a negative ink pattern of a desired circuit in a plasma comprising 60/40 oxygen/argon and then sputtering a thin (10-50 Angstroms) layer of catalytic copper thereover, the treated substrate when exposed to an electroless plating bath will selectively plate only in the areas where there is no ink.
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申请公布号 |
US4354911(A) |
申请公布日期 |
1982.10.19 |
申请号 |
US19810291155 |
申请日期 |
1981.08.07 |
申请人 |
WESTERN ELECTRIC COMPANY INC. |
发明人 |
DODD, THOMAS C.;EMERSON, JOHN A. |
分类号 |
C23C18/16;H05K3/04;H05K3/16;H05K3/24;(IPC1-7):C23C15/00 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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