| 摘要 |
The present invention relates to a semiconductor package with improved reliability. The semiconductor package according to an embodiment of the present invention comprises: a package substrate; a semiconductor chip which is mounted on the upper face of the package substrate; a chip pad which is disposed to face the upper face of the package substrate on the surface of the semiconductor chip, and includes a connection pad and a measurement pad; and a bump which includes a first bump provided between the package substrate and the connection pad, and a second bump provided between the package substrate and the measurement pad, wherein a wired line disposed in the package substrate is not connected to the second bump, so the second bump and the package substrate are electrically insulated from each other. |
