| 摘要 |
PURPOSE:To prevent a short circuit due to the translation phenomenon of silver by forming a silver layer functioning as a bonding pad so that the fringe section of the silver layer is positioned at the inside only by a predetermined distance from the fringe section of the terminal section of a conductive passage shaped to the surface of a substrate when the terminal section is coated with the silver layer. CONSTITUTION:Circuit patterns 2 consisting of copper layers are formed onto the circuit substrate 1, and the surfaces of the patterns 2 are plated with nickel as necessary and coated with nickel layers 3. The terminal sections 4a, 4b of the circuit patterns 2 are coated with the silver layers 5 with approximately 2mu thickness so that the fringe sections are positioned at the inside only by 0.1mm.- 0.15mm. or longer from the fringe sections of the terminal sections 4a, 4b. A semiconductor element 7 is loaded onto the silver layer 5, or a bonding wire 8 is connected. Accordingly, the generation of an electric short circuit condition between conductors on the circuit substrate 1 due to the translation phenomenon of silver can be prevented because there is the sections to be attached 6 of the silver layers 5. |
