发明名称 LEAD FRAME
摘要 PURPOSE:To reduce the rate of defective bonding by forming the shape of the reference mark of bonding formed in the predetermined region of an inner lead in shape having a projecting body with a nose surface on a plane approximately the same as the mounting surface of a bonding wire in a concave section. CONSTITUTION:The lead frame 14 is formed in such a manner that an island 10 and the inner leads 12 are shaped onto a substrate 13 consisting of epoxy resin, etc. The projecting bodies 16b, the nose surfaces thereof are positioned onto the same surfaces as the surfaces of the inner leads 12, are formed at the central sections of the crossed concave sections 15a in projecting shape in the inner leads 12, and the projecting bodies are used as the reference marks 17 of bonding. Accordingly, since the focal distances h2 up to the reference marks 17 of bonding and the focal distances h1 up to the inner leads 12 are equalized, automatic bonding can be conducted while distinctly observing the images of the inner leads 12 by means of a microscope, and the bonding wire 18 can accurately be mounted at the predetermined positions of the inner leads 12.
申请公布号 JPS57169254(A) 申请公布日期 1982.10.18
申请号 JP19810053898 申请日期 1981.04.10
申请人 TOKYO SHIBAURA DENKI KK 发明人 HASHIGUCHI WAKIO
分类号 H01L23/50;H01L21/60 主分类号 H01L23/50
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