| 摘要 |
PURPOSE:To conduct positioning accurately in a short time when measuring by forming a pattern different from a recognizing pattern to the outer edge of a protective film coated onto the semiconductor element. CONSTITUTION:A large number of chips 20 mutually separated by scribing lines 21 are arranged regularly onto a wafer, and each chip 20 is coated with the protective films 22. The patterns 24-24''' are formed to the protective films 22 as the patterns different from the pads 23 of the recognizing patterns used as reference in order to measure about the wafer. |
