| 摘要 |
<p>PURPOSE:To prevent both generation of solder bridge between leads and sticking of splash and excessive solder by a method wherein powdery solder is used for the soldering. CONSTITUTION:The powdery solder 8 is dropped from a nozzle 7 and adhered on the outer circumference of a roller 6 which is being rotated in the direction shown by the arrow P in the diagram, and a circuit part 2 is shifted in the direction shown by the arrow Q while the lead 3, whereon flux was adhered in advance, is contacted to the roller 6. As a result, the powdery solder 8 is adhered on the back side of the lead 3. In this instance, as the solder is in powdery form, there generates no gridge or splash when the soldering is performed.</p> |
