发明名称 INJECTION MOLDING DEVICE AND INJECTION MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an injection molding device capable of suppressing extension of an injection molding cycle, suppressing occurrence of appearance defect of a molded article, and in addition, securing energization heating property of a conductive material and preventing electric leakage to cooling means through a cooling liquid, with a simple structure, when a conductive material is injection molded.SOLUTION: A molding die comprises plural conductive parts which are insulated each other and disposed on at least a part of a cavity formation plane, and a channel in which a cooling liquid can circulate, and which is disposed in the molding die. The injection molding device comprises: cooling means for supplying the cooling liquid to the channel of the molding die; energization means for applying predetermined voltage among the conductive parts; and energization control means for controlling the voltage applied by the energization means. The energization control means applies the voltage among the conductive parts by the energization means, so that the injected conductive material is energized and heated when it contacts the conductive parts of the molding die, and the cooling liquid is an insulation liquid.SELECTED DRAWING: Figure 1
申请公布号 JP2016128237(A) 申请公布日期 2016.07.14
申请号 JP20150003620 申请日期 2015.01.09
申请人 MAZDA MOTOR CORP 发明人 TANAKA TAKAHIRO;IWAMOTO MICHINAO;KATO HIDEKAZU
分类号 B29C45/72;B29C33/02;B29C45/73 主分类号 B29C45/72
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