发明名称 PHOTOPOLYMERIZABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photopolymerizable resin composition exhibiting good resolution after developed and good resist removability.SOLUTION: A photopolymerizable resin composition comprises: (A) 10 to 90 mass% of a binder resin having a carboxyl group content of 100 to 600 in terms of acid equivalent and a weight average molecular weight of 5,000 to 500,000; (B) 5 to 70 mass% of a photopolymerizable unsaturated compound containing a specific compound represented by a bisphenol A dimethacrylate with addition of an ethylene oxide; (C) 0.01 to 20 mass% of a photopolymerization initiator; and (D) 0.05 to 0.5 mass% of a compound represented by general formula (I) below, where Rrepresents a hydrogen atom or a methyl group.SELECTED DRAWING: None
申请公布号 JP2016128914(A) 申请公布日期 2016.07.14
申请号 JP20160011491 申请日期 2016.01.25
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 KINO TOMOHIRO
分类号 G03F7/027;C08F2/44;G03F7/004;G03F7/033;G03F7/20;H05K3/06;H05K3/18 主分类号 G03F7/027
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