发明名称 LIQUID PROCESSING METHOD, LIQUID PROCESSING DEVICE, AND RECORDING MEDIUM
摘要 PROBLEM TO BE SOLVED: To provide a liquid processing method, a liquid processing device, and a recording medium for liquid processing capable of enhancing the uniformity of coating state of process liquid for a substrate.SOLUTION: A coating unit U1 includes a rotation holding section 20 for rotating a wafer W, a nozzle 32 for supplying process liquid R onto a surface Wa of the wafer W, and a control section 60 for controlling the position of the nozzle 32 for the wafer W. A processing method includes a step for starting to supply process liquid R onto the surface Wa of the wafer W at a position eccentric from the center of rotation CL1 of the wafer W, while rotating the wafer W in a first rotation speed ω1, a step for shifting the supply position of process liquid R to the center of rotation CL1 side, and a step for spreading the process liquid R to the outer peripheral side of the wafer W, by rotating the wafer W in a second rotation speed ω2 greater than the first rotation speed ω1, after the supply position of process liquid R has reached the center of rotation CL1.SELECTED DRAWING: Figure 4
申请公布号 JP2016134393(A) 申请公布日期 2016.07.25
申请号 JP20150006032 申请日期 2015.01.15
申请人 TOKYO ELECTRON LTD 发明人 HASHIMOTO TAKASHI;HATAKEYAMA SHINICHI;SHIBATA NAOKI
分类号 H01L21/027;B05C9/10;B05C11/08;B05D1/40 主分类号 H01L21/027
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