| 摘要 |
PROBLEM TO BE SOLVED: To obtain a deposition device capable of suppressing decrease in throughput, while suppressing the maintenance cost.SOLUTION: A deposition device includes a first electrode for mounting an object to be processed, a heater for heating the object to be processed, a second electrode provided oppositely to the first electrode, and applied with a high frequency power so as to generate a plasma between the first electrode and the second electrode, a cooler for cooling the second electrode, a container for housing the first electrode, the heater, the second electrode and the cooler, and a raw material supply section for supplying a material gas of a film formed on the surface of the object to be processed, in the container.SELECTED DRAWING: Figure 1 |
