| 摘要 |
PURPOSE:To inspect the surface of a semiconductor wafer automatically by a method wherein a photo mask having a finely shaped opaque pattern and the same shaped transparent pattern surrounded with the opaque part is used, and after etching is finished, the shapes of the remaining part and the blank part of Al obtained by correspondence are compared. CONSTITUTION:Exposure, development, and etching are performed using a photo mask 2a provided with pattern 10 for inspection having an opaque part 11 and a transparent part 13 to form the Al pattern 14 on a substrate 1. The pattern 14 for exclusive use for inspection is irradiated, enlargement and imaging are performed using a TV camera, and scanning on S-S is performed. After scanning is finished, A/D conversion is performed on thus obtained signals conforming to the reference signals for comparison sent from a control circuit to make the figure to be stored, and the grade of coincidence between the reference pattern and the stored figure pattern is checked. Quantity of the wafer is checked automatically according to the grade of coincidence set previously. |
