| 摘要 |
PURPOSE:To obtain a resist film, thickness thereof is uniform and the surface thereof is flat, by mounting a regulating valve into an exhaust pipe and keeping the quantity of exhasut during the treatment of resist application to predetermined value at all times. CONSTITUTION:A wafer 26 is fixed to a vacuum chuck 12, the resist is ejected from a nozzle 17 while turning the wafer at the prescribed number of revolution and a film is formed. An atmosphere gas in a cup is discharged through a recovery chamber 19 and a duct 21 from a pipe 14, and the opening and closing of a valve 22 is adjusted 24 to keep the predetermined quantity of exhaust at all times. Accordingly, the unevenness of application and reflection are not generated in the resist on the wafer 26, and uniform film thickness is obtained. A resist liquid recovered into a vessel 20 in the chamber 19 is re-treated after applying treatment. When cleaning, connecting members 18 are removed, and the chamber 19 and both the cup 13 and the duct 21 are separated. When the quantity of exhaust gas is abnormal, an alarm is issued, proper treatment is executed, and prescribed value is obtained at all times. |
