| 摘要 |
PURPOSE:To avoid a short circuit by elastically deforming the island section of a lead frame on which a semiconductor pellet is placed and connecting a wire under a condition that a distance between the pellet and the bonding surface of an external lead is enlarged. CONSTITUTION:When a block 6 is pushed up to a base 5, a member holding the island 4 is elastically deformed and rises slightly, and the distance between the bonding surface of the pellet 1 and the bonding surface of the external lead 2 is enlarged. When the wires are connected 3 under this condition and the wires 3 and the shoulder of the pellet 1 contact, the block 6 is dropped, and the upper surface of the block 6 and the upper surface of the base 5 are levelled. Accordingly, the island 4 is returned to a normal condition, and the shoulder section of the pellet is not short-circuited. |
