| 摘要 |
PURPOSE:To perform sure titled soldering free from short circuiting and malfunction by soldering electrical parts to the prescribed copper foil parts of a printed wiring substrate in the build-up parts of the surface of a solder soln. produced by foam then applying finish soldering. CONSTITUTION:In a foam introduction type soldering tank 1, foam is produced from release holes 3, 3' through an introduction pipe 2. Here, a printed wiring substrate 4 is introduced and the electrodes 7 of chip elements 6 are soldered to copper foil parts 8 near the peaks of the build-up of the surface of the solder soln. by the foam. In this case, the solder does not scatter to the surface opposite to the soldering surface 5 through the through-holes 9 of the substrate 4, but the sticking of the solder spatters on the surface 5 on account of bursting of the foam can occur. Therefore, if finish soldering is applied in a static type soldering tank 10, the thorough soldering is accomplished and the stuck solder spatters are removed. The similar effect is obtained by using a jet type soldering tank is this finish soldering stage. |
