Aliphatic diene bis-imide polymers

摘要

A moisture resistant polyimide adhesive is disclosed comprising a polymer having repeating units of the formula: <IMAGE> where n is equal to about 8 to about 20. The improved moisture resistance of the polymers according to the present invention is indicated by a moisture pick-up of less than about 0.6% by weight after 24 hour immersion in room temperature water. The polymer also exhibits a tensile strength greater than about 1800 psi (1.24x107 NT/M2). In addition to their improved adhesive and moisture resistant properties, the polymers according to the present invention exhibited such properties with cure times of less than about one hour at temperatures up to about 320 DEG C.