Semiconductor Packages and Methods of Forming the Same

摘要

Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a first package including one or more dies, and a redistribution layer coupled to the one or more dies at a first side of the first package with a first set of bonding joints. The redistribution layer including more than one metal layer disposed in more than one passivation layer, the first set of bonding joints being directly coupled to at least one of the one or more metal layers, and a first set of connectors coupled to a second side of the redistribution layer, the second side being opposite the first side.

主权项

1. A method comprising:
forming a first die package over a first carrier substrate, the first die package comprising a first die and a first electrical connector; forming redistribution layer over a second carrier substrate, the redistribution layer comprising one or more metal layers disposed in one or more passivation layers; removing the second carrier substrate from the redistribution layer to expose a first passivation layer of the one or more passivation layers; forming openings in the first passivation layer to expose portions of a first metal layer of the one or more metal layers; forming a first set of bonding structures in the openings in the first passivation layer, the first set of bonding structures being electrically coupled to the first metal layer; and bonding the redistribution layer to the first die package using the first set of bonding structures to form a first set of bonding joints, at least one of the first set of bonding joints being bonded to the first die of the first die package and at least another one of the first set of bonding joints being bonded to the first electrical connector.