SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF INTEGRATED CIRCUIT PACKAGES

摘要

A center pad or paddle that is shaped with three or more curved spires which are symmetrical in form about axis that radiate from the center of the integrated circuit package, which takes advantage of the surface tension of solder to produce increased rotational align forces and increased centering forces during package soldering when aligned to a matching shaped pad on the surface of a circuit board.

主权项

1. A solder pad layout comprising:
a center pad portion; and at least three radial lobe portions coupled to the center pad portion positioned radially equidistant about the center pad portion to produce increased rotational alignment forces relative to alignment forces associated with the center pad alone by increasing the ratio of the amount of pad edge.