发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To realize higher mechanical strength and improve anti-corrosion property by adding elements such as Cu, Mg or Mn to Al for wire material. CONSTITUTION:Al alloy which contains at least one element out of a group which consists of 0.5-3.0wt% of Mg, 1.0-3.0wt% of Mn and 0.5-3.5wt% of Cu is used as the material for bonding wire. In order to use as little Au wire as possible, invesigation was made by adding a little amount of some kinds of elements and it was found out that Al alloy which contained additive elements mentioned above could be the material for bonding wire which met the requirements that the junction strength was not less than 6gf, the tensile strength was not less than 30kgf/mm.<2> and the elongation was in the range of 1-2%. And Mg and Mn improve anti-corrosion property of Al.
申请公布号 JPS57164542(A) 申请公布日期 1982.10.09
申请号 JP19810047170 申请日期 1981.04.01
申请人 HITACHI SEISAKUSHO KK;TANAKA DENSHI KOGYO KK 发明人 YAMAMOTO HIROSHI;KIKUCHI MATSUNOSUKE;IWATA SEIICHI;OOTSUKA KANJI;NAKADA KENSUKE;TANIMOTO MICHIO;MATSUBARA SATORU;FUKUI YASUO
分类号 H01L21/60 主分类号 H01L21/60
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