| 摘要 |
A heat dissipation device having high power loss density for gaseous or liquid coolants. To increase the performance of electronic modular packing systems, highly integrated components are mounted on epoxide conductor boards with narrow spacings and without a casing. Under these conditions the power loss heat should be effectively removed. For this purpose, the invention provides a carrier plate 1 with good heat conduction which is used to receive one or more integrated circuits 2 on one side and is provided with singly arranged pins 3 with good heat conduction on the other side, which pins can be pushed through matching bores 4 of the conductor board 5 and can project, on the side of the conductor board remote from the components, into the coolant, which may be liquid, atmospheric or gaseous. This achieves extremely low chip temperatures. <IMAGE> |
