| 摘要 |
<p>PURPOSE:To reduce residual stress to be applied on the package main body of a semiconductor device by a method wherein a semiconductor element is accommodated in the concave part of the ceramic package main body, a metal ring is fixed with silver solder, and a cap is welded electrically. CONSTITUTION:The LSI element 13 is accommodated in the ceramic package 11 provided with the circular concave part 12 having the inside diameter 25mm., and is connected to leads 14 on the bottom of the package. The Kovar ring 15 having the inside diameter 25mm., the outside diameter 27mm., is fixed with silver solder to the circumference of the opening of the concave part 12, and the Kovar cap 16 is fixed thereon by electric welding to seal the opening. Because electric welding is used, even when the concave part 12 is made to have the large caliber of about 25mm., residual stress to be generated by the difference of thermal expansion between the ring 16 and the main body can be reduced. Accordingly deformation and destruction of the package main body can be avoided without using solder and gold enabling to attain airtight sealing. When the concave part and the metal ring have the rectangular shape, the edges of the inside and the outside are selected respectively as 20mm., 24mm..</p> |
