| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid sealing resin composition for compression molding that shows excellent reactivity even at low temperature, has excellent long-term storage stability, and is suitable for sealing a semiconductor device for FO-WLP, and a semiconductor device.SOLUTION: A solid sealing resin composition for compression molding comprises (A) epoxy resin, (B) curing agent, and (C) an adduct of a phosphine compound and a quinone compound as components.SELECTED DRAWING: Figure 1 |
