| 摘要 |
PURPOSE:To perform accurately measurement of brightness of wafer by an automatic wafer tester by a method wherein a stage for inker is provided separatedly from a stage for measurement, positionining of wafer are performed at the respective stages, and influence of reflection and shades to the optical path to be applied by the inker of prober is avoided. CONSTITUTION:The wafers are taken out one after another by a loader 17 according to the start signal of the prober 12, and are sent to a sensor 18, and a measurement table 14 is controlled 20 to perform positioning of the wafer. The measured informations are transmitted to a tester 11 through the probe by a card 13, and the judged signal and the positioning signal of the respective pellet are stored in order. The pellets are transferred to a sensor 19 when measurement of the whole pellets is finished, and after a working desk 16 is controlled 20 to find out the pellet on the starting point, positioning is performed, and driving of index is performed. The inker 15 is driven selectively by a memory 22, and control of change-over is performed 20 to store the next signal in a memory 21. When marking operation is finished on the whole pellets, the pellets are unloaded 24 automatically in an accommodating box. By this constitution, CCD, LED, etc., can be measured accurately and automatically. |
