发明名称 BONDING WIRE AND WIRE BONDING
摘要 PURPOSE:To contrive to make a bonding wire sufficiently finely and to reduce the cost price by a method wherein the surface of the bonding wire is coated with a resin insulating film. CONSTITUTION:The gold wire 12 is coated with a resin film 13 of polyimide, polyurethane, Teflon, etc. The resin film 13 thereof is peeled off simply by external mechanical force when bonding is to be performed, and bonding is performed using a tool 10, a gold ball 15 is formed at the tip end of the bonding wire 14 being molten by hydrogen flame, and the resin film 13 on the surface of the ball is removed completely. Accordingly ultrasonic bonding to pellet or stitch bonding to lead can be performed without a hindrance. Moreover reduction of cost price can be attained by forming the core wire 12 sufficiently finely depending on insulation and reinforcement of the film 13. When the film 13 is formed with slippry resin, blocking in the tool 10 is also prevened, and short- circuit to be generated by the bonding wire is also prevented.
申请公布号 JPS57162438(A) 申请公布日期 1982.10.06
申请号 JP19810049077 申请日期 1981.03.31
申请人 SHIN NIPPON DENKI KK 发明人 KUROKI HAYASHI
分类号 H01L21/60 主分类号 H01L21/60
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