发明名称 ANNEALING METHOD FOR SILICON SEMICONDUCTOR
摘要 PURPOSE:To enable the completion of a preferable annealing with doping efficiency being higher than 45% by maintaining the preliminarily heating temperature, reflectivity, pulse width and emitting energy in a special relationship, thereby emitting flash from a flash discharge lamp. CONSTITUTION:When a silicon semiconductor 6 preliminarily heated in advance to a temperature TA deg.C is annealed by flash emission from a flash discharge lamp 3, under the conditions of maintaining the relationship that (t) falls in the range of 70<=t<=780, where R represents the reflectivity of the silicon semiconductor, (t) microsecond represents the pulse width (1/2 wave amplitude) of the flash light, and E joule/cm<2> represents the emitting intension on the silicon semiconductor and 2.3X10<-3>t<0.27=(1-R)E/(1,410-TA)<=3.8X10<-3>t<0.28> is maintained. For example, a plurality of flash discharge lamps 3 are intimately contacted in zigzag shape in a light source, a plane mirror 4 is disposed on the light source, a specimen base 5 is disposed capable of preliminarily heating with a heater under the mirror in an annealing furnace, and the semiconductor is annealed under the above conditions.
申请公布号 JPS57162340(A) 申请公布日期 1982.10.06
申请号 JP19810046256 申请日期 1981.03.31
申请人 USHIO DENKI KK 发明人 ARAI TETSUHARU;IGARASHI RIYUUSHI
分类号 H01L21/26;H01L21/268;(IPC1-7):01L21/324 主分类号 H01L21/26
代理机构 代理人
主权项
地址