| 摘要 |
PURPOSE:To improve the manufacturing yield of a semiconductor device by coating a resist on a wafer of approximately circular shape and then removing the resist of the outer periphery while rotating the wafer, thereby preventing the notch of the resist at the outer periphery. CONSTITUTION:A resist 2 is coated while rotating a wafer 1 of approximately circular shape, and the resist 2'' is then removed at the outer periphery while rotating the wafer 1. For example, a positive resist 2 is rotatably coated on the wafer 1 placed on a rotary base 3, an energy beam such as ultraviolet ray is emitted through an optical fiber 5 to the resist 2'' of the outer periphery while rotating the wafer, thereby allowing the resist 2'' of the outer periphery to be sensed with the light. Thereafter, when the resist 2 of the center is exposed in the prescribed pattern and is developed, the resist 2'' of the periphery is simultaneously removed. |
