METHOD OF SELECTIVELY DEPOSITING METAL ON A CERAMIC SUBSTRATE WITH A METALLURGY PATTERN

摘要

METHOD OF SELECTIVELY DEPOSITING METAL ON A CERAMIC SUBSTRATE WITH A METALLURGY PATTERN A liftoff process for selectively depositing additional metal layers on an existing metallurgy pattern supported on a dielectric substrate which includes the steps of (1) depositing a hardenable material on the dielectric substrate which has the characteristic of wetting the substrate surface, but not the existing metallurgy pattern, (2) heating the hardenable material to convert it to a liquid wherein the material is distributed to cover the dielectric substrate surface, but not the metallurgy pattern,(3) cooling the hardenable material to solidify it,(4) depositing a blanket layer of metal on the surface of the substrate, (5), dissolving the hardenable material in a suitable solvent thereby removing the material and the overlying metal layer portions.