| 摘要 |
<p>PURPOSE:To maintain nearly maximum space efficiency and also to permit automatic alignment in the transfer of a parts feeder by placing the center of gravity of a semiconductor device at the position away from a center. CONSTITUTION:The center of gravity locates at right side from the center of a semiconductor device as the right half of a package part 1 is thicker than the left half of the package part 1 in the semiconductor device. As a result, when the semiconductor device is automatically transferred by a part feeder, the semiconductor device is transferred with directionality by providing the parts feeder with a commonly used conventional attachment for aligning direction by a difference in balance. Furthermore, mounting space for a printed substrate will not be increased and compactness can be maintained because only a part of the package 1 is made thick in this device. Furthermore, the arrangement of leads 2 is the same as conventional arrangement. Accordingly, the space efficiency of the package 1 is the highest one.</p> |
