| 摘要 |
PURPOSE:To make it possible to automatically correct the bonding position through detecting the offset of actual position from a predetermined set position, by providing a specific alignment mark on a tape carrier or by memorizing the shape of a part of the inner lead. CONSTITUTION:A carrier tape 1 provided with successive inner leads is fed intermittently at a pitch corresponding to the pitch of the inner leads, and the inner leads are successively located at bonding positions. Simultaneously, a wafer X-Y feeder 17 feeds and locate a substrate 14 at a pitch corresponding to the pitch of dies 15. Then, an ITV camera 19 picks up the image of the inner lead on the tape 1 at the bonding position and the image of the die 15 on the substrate 14, and the positional offset is detected by means of an alignment mark on the carrier tape 1 or the shape of a specific position characterizing the position of the inner lead. Subsequently, the feeder 17 is actuated to effect the aligning of the inner lead and then a bonding is conducted by a bonding device 18. |
