| 摘要 |
PURPOSE:To make dimensional accuracy stable and improve mass productivity by a method wherein Al is applied to the surface of the element fitting part and the wiring connecting pant and the element is fitted by thermosetting resin and connected to the connecting position by thin Al wire. CONSTITUTION:After plating 12 is applied to the composition member 11 of a lead frame for anticorrosive and improvement of solderability, Al plating 13 is applied to the semiconductor element fitting pant and the wiring connecting position. Then a semiconductor element 15 is fitted to the element fitting part of the lead frame by conductive paste or thermosetting resin 14 and the electrode of the element 15 is connected to the wiring connecting position by thin Al wire 16. |
