SEMICONDUCTOR DEVICE

摘要

PURPOSE:To enable the accurate testing of the semiconductor device by a method wherein the semiconductor is provided with lead pins repsectively for impressing and measuring the power supply voltage. CONSTITUTION:The printed wiring 12 for the power supply voltage is provided on the multilayer printed substrate 10 while the lead wire 16 of the mounted IC tip 14 is connected to the said wiring 12 and at the same time the lead pin 18 for impressing the power supply voltage and the lead pins 20 for measuring the power supply voltage are provided to connect to said printed wiring 12 and the other printed wiring 22. Through these procedures, even if there is a contact resistance between a semiconductor device and a jig, it is possible to accurately measure the power supply voltage impressed on the IC circuit tip making the evaluation reliable.