| 摘要 |
PURPOSE:To obtain high etching accuracy by placing a wafer in parallel with the flow of medicine solution, thereby treating it with the solution at the prescribed temperature and uniformalizing the etching velocity. CONSTITUTION:When etching medicine solution 14 is stored in an auxiliary tank 15 and a pump 16 is operated, the solution 14 is let from the tank 15 to a pump 16, and is forcibly fed to a supply port 12. The solution 14 supplied to a cleaning tank 11 is returned through an exit 13 to the tank 15, and is circulated. The solution 14 in the tank 11 is controlled by a valve 17 to set in the prescribed height from the bottom surface of the cleaning tank to direct the solution 14 of the prescribed velocity and flow rate to the exit 13, and the solution 14 reached to the exit 13 is all exhausted. A wafer 10 is dipped in this state in the solution 14 in parallel with the bottom surface of the cleaning tank at the surface of the wafer, is thus treated, and is then washed with water. |
