| 摘要 |
PURPOSE:To solidify the mount as well as to extend the life of the subject light- emitting device by a method wherein an element is supported at the point of a capillary tube using the tension of the lead which was bonded at the upper electrode of a semiconductor laser element, and the element is slidingly positioned and adhered on a heat sink. CONSTITUTION:An electrode lead 6 is bonded on the upper electrode of the semiconductor laser element 2, and the laser element is retained at the point of the capillary tube utilizing the tension of the lead. Then, the element is slidingly moved in the state wherein the lower electrode of the laser element is contacted to the heat sink 3 in which a eutectic metal is fused in the heated A which was heated in advance. The laser element is positioned and stopped at the prescribed position, the heat sink is cooled, and the eutectic metal 4 is solidified. Accordingly, the positional deviation of the laser element is prevented, and the mount is solidified, thereby enabling to contrive improvement of the yield rate and the long life of the mount. |
