发明名称 MULTITIP PACKAGE
摘要 PURPOSE:To prevent low withstand voltage electronic functional elements from breaking down by a method wherein the multiple electronic functional elements with the different withstand voltage are provided on the supporting substrate and the separated sections are shortcircuited with the functions of each element maintained in the insulated status. CONSTITUTION:The high voltage electronic element A such as PROM and the like maintaining the specified functions by means of improving the sepecified voltage exceeding the maximum rated voltage of the low withstand voltage electronic functional element B are mounted on the supporting substrate 21. Then said elements A and B are respectively connected to the bonding pad 25 and the separated sections 27a-27d comprising the twin terminals are simultaneously provided making the element A maintain the specified functions with each element insulated from each other and making said twin terminals shortcircuit to connect the elements A and B to each other electrically. Through these procedures, it is made possible to mount the elements with different withstand voltages on the same substrate and to prevent the low withstand voltage electronic functional elements from breaking down without fail.
申请公布号 JPS57159054(A) 申请公布日期 1982.10.01
申请号 JP19810044384 申请日期 1981.03.26
申请人 TOKYO SHIBAURA DENKI KK 发明人 FUKUOKA YOSHITAKA
分类号 H01L23/52;H01L21/8247;H01L23/538;H01L23/62;H01L29/788;H01L29/792 主分类号 H01L23/52
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