发明名称 MANUFACTURE OF THREE-LAYER PARTICLE BOARD
摘要 PURPOSE:To obtain a three-layer particle board with superior surface quality without a need of sanding by a method wherein polyethyleneglycol is added at a specific ratio to an amino resin adhesives blended solution which is used to form front and rear layers. CONSTITUTION:A mixture obtained by adding (B) 5-50pts.wt. of polyethyleneglycol to (A) 100pts.wt. of adhesives blended solution for front and rear surfaces, which consists of amino resin adhesives used for usual particle boards, ammonium chloride, aqueous ammonia or the like, is coated over timber chips, for example, at 20% thereby to obtain chips for front and rear surfaces. These chips for front and rear surfaces are laminated together with a chip for core layer so as to form a mat of a three-layer construction, and then said mat is pressed under heating thereby to attain the desired particle board. EFFECT:Loss of timbers due to sanding can be reduced.
申请公布号 JPS57159637(A) 申请公布日期 1982.10.01
申请号 JP19810045415 申请日期 1981.03.30
申请人 SANYO KOKUSAKU PULP KK 发明人 OOTA NOBUHIKO;NISHIZUMI TOSHIJI;TAODA HIROSHI;HONDA KAZUMI
分类号 B32B21/02;B27N3/06;C08L97/02 主分类号 B32B21/02
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