| 摘要 |
PURPOSE:To measure bonding strength of a lead wire bonded to a semiconductor chip exactly and easily, by constituting a device so that a load is applied in the normal direction of a bonding surface. CONSTITUTION:The first arm 11 moves along guide rails 13, 13' by two interlocking cams 12, 12'. To the tip of the first arm 11, a tension gauge 16 and the second arm 14 are installed, and the second arm 14 is held in paralell with the first arm by a spring. To the tip of the second arm, a chuck 15 for holding a wire to be tested is installed. When the first arm 11 moves upward in order to test bonding strength of a lead wire being an object to be tested 7, the second arm 14 executes a rotating movement by making a connecting point of the first arm its supporting point, its angle of rotation is proportional to applied force, and it is indicated on a tension gauge 16. |
