| 摘要 |
The invention relates to an ultrasonic pick-up, in particular for analysing sound emissions. According to the invention, a piezoelectric member (2) is provided which can be applied by means of an application surface of very slight extent, preferably an application surface which is approximately punctiform, to the surface of a body (5) to be investigated, and is applied by means of a further application surface of very slight extent to a seismic mass (4) and which is embedded in a damping member (3). This ultrasonic pick-up can be used as a position pick-up in the frequency range of a &sinew& 100Hz-1MHz. <IMAGE>
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