发明名称 ASSEMBLING DEVICE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To connect a metallic small wire and the electrode of a pellet, etc. strongly by applying vibration to the metallic small wire from the two different directions. CONSTITUTION:The second ultrasonic horn 7 is mounted at a position in the direction different from a conventional ultrasonic horn 6, a capillary 8 is penetrated to both noses, and both horns are fixed. When adjusting the phase of AC signals applied to the vibrators 9, 10 of each horn, the crushed shape of a ball can be formed in an approximately circle. Accordingly, the displacement of the center of the ball, the increase of a diameter in the vibrating direction and the insufficiency of adhesive strength in the non-vibrating direction as seen in one horn are removed, and reliability is improved.
申请公布号 JPS57157534(A) 申请公布日期 1982.09.29
申请号 JP19810042164 申请日期 1981.03.23
申请人 NIPPON DENKI KK 发明人 MIYAKOSHI KAZUYUKI
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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