发明名称 MANUFACTURE OF INTEGRATED CIRCUIT
摘要 <p>PURPOSE:To control the manufacturing condition or process of the IC by converting informations obtained by crossing and scanning the recognition mark of the surface of a semiconductor substrate into digital signals and inputting the signals to a processor. CONSTITUTION:The Si substrate 51 on which the mark 52 of a circle or a similar closed curve is put is encased in a box 53, laser beams 41 are forcussed 42 and introduced onto the surface of the substrate through a fixed reflector 43, a polyhedral rotary mirror 44 and a fixed reflector 45, and the mark is crossed and scanned. Reflected light is detected 47 through a reflector 46, amplified and photoelectric-converted 48, and AD- converted 49. The informations obtained are processed 50, the commands of the manufacturing conditions or processes of separate substrate are emitted, and a laser system is controlled 54. When the width of bars 55, 58 is made double as large as 56 and 57, a space 61 is made double as large as 59 and 60 and the bars are optically scanned, photoelectric-converted and video-processed as the example of the marks, a pulse wave- form is obtained. Signals bit-expressed are octal-processed through AD conversion. According to this method, the substrate need not be positioned accurately, the informations can easily be transmitted to the processor, and the manufacturing process can be automated.</p>
申请公布号 JPS57157518(A) 申请公布日期 1982.09.29
申请号 JP19810043306 申请日期 1981.03.25
申请人 NIPPON DENKI KK 发明人 SUGIYAMA HISASHI;YAMAMOTO HIROHIKO;MIYAZAKI SUSUMU
分类号 H01L21/02;H01L23/544 主分类号 H01L21/02
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